Disco dicing saw manual

DISCO HI-TEC EUROPE GmbH. Dicing-Grinding Service. Liebigstrasse 8 D Kirchheim b. München Germany. Phone +49 89 Fax +49 89 dgs@www.doorway.ru 2/30 DISCO CONFIDENTIAL –only for customers ¤ DISCO CORPORATION All rights reserved Contents • DAD// overview • Main features – Feature 1 File Size: 1MB. DISCO Terms Dictionary Precision Processing Tools Rev. Training Center Global Training Department DISCO Corporation A precision processing tool, used with dicing saws to groove and dice for all “Kiru” (dicing) processes. It consists of diamond: abrasives. and bond.

Standard Operating Procedure: Dicing Saw Page 1 of 15 Revision Created December 7th, Hardware Description and Principle of Operation Disco DAD Dicing Saw The Disco Dicing Saw is a single spindle dicing saw, capable of handling work-pieces up to a maximum off 6" square or 6" in diameter. The system features an LCD touch panel, auto-. Dicing is a process for cutting and making grooves using dicing blades. Dicing blades are abrasive blades that use synthetic diamond as the abrasive grit. The outer diameter of the dicing blade is approx. 50 mm and thickness is approx. - mm. There are various types of blades with different grit sizes, bond materials, and shapes. Dicing tape has different properties depending on the dicing application. UV curable tapes are used for smaller sizes and non-UV dicing tape for larger die sizes. Once a wafer has been diced, the die will stay on the dicing tape until they are extracted. The Disco DAD is a single spindle dicing saw which can take up to 6" of substrates.

Compact manual dicing saw. The DAD is a distinctly compact manual dicing saw with support for Φ8-inch workpieces at a width of only mm. High maintainability. Built-in microscope with a lens shutter and scope blow function reduces maintenance frequency, which increases the utilization rate. Ease of operation. Disco Dicing Saw SOP Page 3 of 13 Revision In this case: Turn off alarm (as in Note 1), and press CUT WATER key to stop DI water from being wasted. From this point, inspect the wafer, as in Note 5, before resuming cutting. When cutting is resumed, it will restart at the last, halted, index (y) position. 7. Setup Procedures. DISCO DAD DICING SAW STANDARD OPERATING PROCEDURE Page 6 Adjust light and focus Make alignments for Channel 1, followed by Channel 2. Select initial dicing point, press Start. After dicing completes, remove work from chuck. Manually cut single channel Follow above procedure.